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Interfacial Reactions between Lead-Free Solders and the Multilayer Au/Ni/SUS304 Substrate

  • Yee-Wen Yen , Chun-Yu Lee , Meng-Han Kuo , Kuo-Sing Chao and Kuen-Da Chen
Published/Copyright: June 11, 2013
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International Journal of Materials Research
From the journal International Journal of Materials Research Volume 100 Issue 5

Abstract

Interfacial reactions between Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and an Au/Ni/SUS304 stainless steel (SUS304) substrate were conducted using the reaction couple technique at 240, 255 and 270 °C for 1 – 5 h. In the earliest stage of the reaction, only the Ni3Sn4 phase was formed on the Sn/Au/Ni/SUS304 interface. As the reaction time increased to 4 h, the Ni layer was gradually consumed and the Ni3Sn4 phase detached from the interface. Meanwhile, the Sn reacted with the SUS304 to form the FeSn2 phase. In the SAC/Au/Ni/SUS304 reaction couple, both Ni3Sn4 and Cu6Sn5 phases were formed on the interface. When the reaction time exceeded 4 h, the Ni3Sn4 phase disappeared; the Cu6Sn5 phase was spread over the SUS304 surface and the FeSn2 phase was formed on the SUS304 surface. The growth of intermetallic compounds can be described by the parabolic law and the reactions were diffusion-controlled.

Keywords: Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC); Stainless steel; Reaction couple; Intermetallic compound; Diffusion-controlled
* Correspondence address, Prof. Yee-Wen Yen, National Taiwan University of Science and Technology, Graduate Institute of Materials Science and Technology, 43 Keelung Road, Sec. 4, Taipei 10672, Taiwan, ROC, Tel.: +886 2 2737 6659, Fax: +886 2 2730 1265, E-mail:

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Received: 2008-1-10
Accepted: 2008-11-4
Published Online: 2013-06-11
Published in Print: 2009-05-01

© 2009, Carl Hanser Verlag, München

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https://doi.org/10.3139/146.110080
Keywords for this article
Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC); Stainless steel; Reaction couple; Intermetallic compound; Diffusion-controlled

Articles in the same Issue

  1. Contents
  2. Contents
  3. Feature
  4. Nd–Fe–B permanent magnets a quarter century later: implications for patentability
  5. Micromagnetism of advanced hard magnetic materials
  6. Magnetism of nanostructured materials for advanced magnetic recording
  7. Basic
  8. A Study of the Al–Mg–B Ternary Phase Diagram
  9. Effects of Lanthanum on Magnetic Behavior and Hardness of Electroless Ni–Fe–P Deposits
  10. Interfacial Reactions between Lead-Free Solders and the Multilayer Au/Ni/SUS304 Substrate
  11. Melting Behavior of Sn–Bi Alloy Powder Compacts Observed Using Optical Dilatometry
  12. High-Strength Mg-Based Bulk Metallic Glass Composites with Remarkable Plasticity
  13. Determination of Liquidus Temperature in Sn–Ti–Zr Alloys by Viscosity, Electrical Conductivity and XRD Measurements
  14. The coupled FEM analysis of super-high angular speed polishing of diamond films
  15. Applied
  16. Comparison of Depth-Sensing Indentation at Ultramicroscopic Contacts by Single- and Multiple-Partial-Unload Cycles
  17. Sintering Behavior of ZnO: Mn Ceramics Fabricated from Sol-Gel Derived Nanocrystalline powders
  18. Suitability of Maraging Steel Weld Cladding for Repair of Die-Casting Tooling
  19. Enhanced properties of functionally graded Cu–Cr powder compacts
  20. Influence of Cr on the microstructure and mechanical properties of Ti–Si Eutectic Alloys
  21. Notifications
  22. DGM News
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