Integrating low dielectric constant and high thermal conductivity into composite films for 5G circuit package substrate
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Caijie Shi
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Luoxin Wang
Abstract
The high-frequency, integrated, and miniaturized circuits increase the risks of electromagnetic interference and heat accumulation. However, it is difficult for the traditional circuit package substrate to realize both low dielectric and high thermal conductivity, resulting in high-quality signal transmission and fast heat dissipation cannot be achieved simultaneously. Here, for the first time, composite films (hBN/LCPs) with low dielectric constant in high-frequency and high thermal conductivity are prepared based on liquid crystal aromatic polyesters (LCPs) and hexagonal boron nitride (hBN). The highest thermal conductivity of hBN/LCPs film reaches 0.696 W m−1 K−1, which is 3.3 times higher than that of the pristine LCPs. In the simulation of wafer heat dissipation, hBN/LCPs film shows a maximum surface temperature decrease of over 20 °C compared to the pristine LCPs, showing the fast heat transfer ability. The dielectric constants and dielectric losses of hBN/LCPs films keep the low values in the range of 0.4–1 GHz, being less than 3.4 and 0.007, respectively, meeting the requirements of 5G communication devices. Meanwhile, the hBN/LCPs films show good mechanical strength and heat resistance. Therefore, a low-cost and facile method is developed to prepare composite films with low dielectric and high thermal conductivity for 5G circuit package substrates.
Funding source: Hubei Provincial Natural Science Foundation of China
Award Identifier / Grant number: 2023AFB808
Funding source: National Key R&D Program of China
Award Identifier / Grant number: 2021YFB3700101
Funding source: China National Textile and Apparel Council
Award Identifier / Grant number: J202101
Acknowledgments
The authors would like to thank shiyanjia lab (www.shiyanjia.com) for the support of dielectric test. We also appreciate the Analytical and Testing Center of Wuhan Textile University for the XRD tests.
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Research ethics: Not applicable.
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Informed consent: Not applicable.
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Author contributions: Caijie Shi: methodology, investigation, formal analysis, validation, data curation, writing – original draft. Xuyi Wang: conceptualization, resources, visualization. Qiannan Cheng: methodology, investigation, formal analysis. Qingquan Tang: conceptualization, supervision, project administration, writing – original draft, writing – review & editing. Luoxin, Wang: project administration, funding acquisition. Hua Wang: project administration, funding acquisition, writing – review & editing. Siwei Xiong: conceptualization, methodology, visualization. All authors have accepted responsibility for the entire content of this manuscript and approved its submission.
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Use of Large Language Models, AI and Machine Learning Tools: None declared.
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Conflict of interest: The authors state no conflict of interest.
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Research funding: The authors gratefully acknowledge financial support from the National Key R&D Program of China (2021YFB3700101) and the China National Textile and Apparel Council (J202101); the Project Supported by the Open Fund of State Key Laboratory of Biobased Fiber Manufacturing Technology, the Hubei Provincial Natural Science Foundation of China (2023AFB808), the Open Project Program of High-Tech Organic Fibers Key Laboratory of Sichuan Province.
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Data availability: The datasets generated and/or analyzed during the current study are available from the corresponding authors on reasonable request.
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Supplementary Material
This article contains supplementary material (https://doi.org/10.1515/polyeng-2024-0213).
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