Startseite High-temperature creep behavior and hot-pressing consolidation of NiAl
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High-temperature creep behavior and hot-pressing consolidation of NiAl

  • Hao Chen , Weiping Hu , Yunlong Zhong und Günter Gottstein EMAIL logo
Veröffentlicht/Copyright: 10. Februar 2022
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Abstract

The steady-state creep behavior of NiAl was studied by constant strain-rate tests in the strain-rate regime 1.5 × 10−4≤ ɛ̇ ≤ 1.0 × 10−2 s−1.Primary creep of NiAl was investigated at different stresses (10 MPa−40 MPa) in the temperature range from 1200 to 1400°C. The steady-state creep rate was fitted to a temperature-compensated power-law expression ɛ̇ = B(σ/μ)n exp(−Q/RT), from which a stress exponent n≈3.5 and an activation energy Q ≈ 398 kJ/mol were derived, respectively. The obtained activation parameters indicate that dislocation creep dominates the creep behavior of NiAl at temperatures above 1200°C up to 1400°C. The transient creep behavior at 40 MPa could be fitted to a power-law equation ε = ε0 + btm with b α σ3:5 and 0.52<m<0.68. The creep data of NiAl obtained in this study were utilized for modeling and simulation of the consolidation process of NiAl composites during hot pressing by finite-element analysis.

Keywords: NiAl; Creep; Hot pressing

Prof. Dr. G. Gottstein RWTH Aachen Institut für Metallkunde und MetallphysikKopernikusstr. 14, D-52056 Aachen, Germany Tel.: +49 241 80 26860 Fax: +49 241 80-22608

Dedicated to Prof. Dr.-Ing. Dr. h. c. mult. Reiner Kopp on the occasion of his 65th birthday


  1. The authors would like to thank T. Burlet for help with the experiments and M. Loeck for assistance with the simulations. Financial support from the Deutsche Forschungsgemeinschaft through the collaborative research center SFB561: “Thermally highly loaded porous and cooled Multi-Layer Systems for Combined Cycle Power Plants” is gratefully acknowledged.

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Received: 2004-06-30
Accepted: 2004-09-15
Published Online: 2022-02-10

© 2004 Carl Hanser Verlag, München

Heruntergeladen am 16.11.2025 von https://www.degruyterbrill.com/document/doi/10.1515/ijmr-2004-0197/pdf
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