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Microelectromechanical Implants: Encapsulation Concepts and Test Procedures

  • W. Betz EMAIL logo , H. K. Trieu and H. Vogt
Published/Copyright: August 27, 2012

Published Online: 2012-08-27

© 2012 by Walter de Gruyter Berlin Boston

Downloaded on 1.10.2025 from https://www.degruyterbrill.com/document/doi/10.1515/bmt-2012-4292/html
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