Article
Open Access
Boric Acid Containing Polyimide as a Route to Low Heat Releasing Materials
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Süleyman Köytepe,
Published/Copyright:
June 1, 2009
Published Online: 2009-06
©2011 by Walter de Gruyter GmbH & Co.
Articles in the same Issue
- TABLE OF CONTENTS
- Influence of Content and Diameter of Fibres and Chemical Treatment on the Dielectric Properties of Oil Palm Fibres - Rubber Composites
- Response of Alumina/4340 Steel Laminated Composites against the Impact of 7.62 mm Armor Piercing Projectiles
- Modeling of Delamination Initiation and Propagation in Composite Laminates Under Monotonie Tensile Loading Using the Progressive Damage Modeling Technique
- Effect of Wax and Polystyrene Emulsion on Water Absorption and Mechanical Properties of Pine Cellulosic Fibers-Adhesive Based Polymer Composite
- Microstructure of the BNf/Si3N4 Composites Prepared by LPCVD
- Boric Acid Containing Polyimide as a Route to Low Heat Releasing Materials
Creative Commons
BY-NC-ND 3.0
Articles in the same Issue
- TABLE OF CONTENTS
- Influence of Content and Diameter of Fibres and Chemical Treatment on the Dielectric Properties of Oil Palm Fibres - Rubber Composites
- Response of Alumina/4340 Steel Laminated Composites against the Impact of 7.62 mm Armor Piercing Projectiles
- Modeling of Delamination Initiation and Propagation in Composite Laminates Under Monotonie Tensile Loading Using the Progressive Damage Modeling Technique
- Effect of Wax and Polystyrene Emulsion on Water Absorption and Mechanical Properties of Pine Cellulosic Fibers-Adhesive Based Polymer Composite
- Microstructure of the BNf/Si3N4 Composites Prepared by LPCVD
- Boric Acid Containing Polyimide as a Route to Low Heat Releasing Materials
