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Surface Stress on Isotropic Solids under Dissipative Processes: Appendices
-
A. Sanfeld
Published/Copyright:
June 1, 2005
Published Online: 2005-06-01
Published in Print: 2003-05-08
Copyright © 2003 by Walter de Gruyter GmbH & Co. KG
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Articles in the same Issue
- Work Limits in Imperfect Sequential Systems with Heat and Fluid Flow
- Surface Stress on Isotropic Solids under Dissipative Processes
- Surface Stress on Isotropic Solids under Dissipative Processes: Appendices
- Thermodynamic Steady States in Simple Electrical Circuits
- Thermodynamics of Flow Boiling Heat Transfer
- GENERIC Compliance of a Temporary Network Model with Sliplinks, Chain-Length Fluctuations, Segment-Connectivity and Constraint Release
Articles in the same Issue
- Work Limits in Imperfect Sequential Systems with Heat and Fluid Flow
- Surface Stress on Isotropic Solids under Dissipative Processes
- Surface Stress on Isotropic Solids under Dissipative Processes: Appendices
- Thermodynamic Steady States in Simple Electrical Circuits
- Thermodynamics of Flow Boiling Heat Transfer
- GENERIC Compliance of a Temporary Network Model with Sliplinks, Chain-Length Fluctuations, Segment-Connectivity and Constraint Release
