Formation of Microcracks in Heavily Drawn and Annealed Tungsten

L. Uray,; I. Gaal,

doi:10.1515/HTMP.1994.13.1.87

Startseite Naturwissenschaften Formation of Microcracks in Heavily Drawn and Annealed Tungsten

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Formation of Microcracks in Heavily Drawn and Annealed Tungsten

L. Uray, und I. Gaal,

Veröffentlicht/Copyright: 6. Mai 2011

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Aus der Zeitschrift High Temperature Materials and Processes Band 13 Heft 1

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Harvard
Chicago
Vancouver

Uray,, L. and Gaal,, I.. "Formation of Microcracks in Heavily Drawn and Annealed Tungsten" High Temperature Materials and Processes, vol. 13, no. 1, 1994, pp. 87-96. https://doi.org/10.1515/HTMP.1994.13.1.87

Uray,, L. & Gaal,, I. (1994). Formation of Microcracks in Heavily Drawn and Annealed Tungsten. High Temperature Materials and Processes, 13(1), 87-96. https://doi.org/10.1515/HTMP.1994.13.1.87

Uray,, L. and Gaal,, I. (1994) Formation of Microcracks in Heavily Drawn and Annealed Tungsten. High Temperature Materials and Processes, Vol. 13 (Issue 1), pp. 87-96. https://doi.org/10.1515/HTMP.1994.13.1.87

Uray,, L. and Gaal,, I.. "Formation of Microcracks in Heavily Drawn and Annealed Tungsten" High Temperature Materials and Processes 13, no. 1 (1994): 87-96. https://doi.org/10.1515/HTMP.1994.13.1.87

Uray, L, Gaal, I. Formation of Microcracks in Heavily Drawn and Annealed Tungsten. High Temperature Materials and Processes. 1994;13(1): 87-96. https://doi.org/10.1515/HTMP.1994.13.1.87

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Published Online: 2011-05-06

Published in Print: 1994-01

Artikel in diesem Heft

CONTENTS
Some Properties of New Composite Powders Containing Boride and Aluminide Phases for Thermal Spraying Processes
The Effect of Process Annealing on the Recrystallization of Lamp Grade Tungsten
Influence of Processing Parameters on the Substructure of Ods Alloys
Void Growth Mechanism in Bubble Strengthened Tungsten
Cyclic Stress Strain Behaviour of High-Melting Point Metals
Fracture Toughness of High Melting Point Materials
Formation of Microcracks in Heavily Drawn and Annealed Tungsten
Dependence of Material Properties on Processing History during Wire Drawing of Commercially Doped Tungsten Lamp Wire

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https://doi.org/10.1515/HTMP.1994.13.1.87

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Artikel in diesem Heft

CONTENTS
Some Properties of New Composite Powders Containing Boride and Aluminide Phases for Thermal Spraying Processes
The Effect of Process Annealing on the Recrystallization of Lamp Grade Tungsten
Influence of Processing Parameters on the Substructure of Ods Alloys
Void Growth Mechanism in Bubble Strengthened Tungsten
Cyclic Stress Strain Behaviour of High-Melting Point Metals
Fracture Toughness of High Melting Point Materials
Formation of Microcracks in Heavily Drawn and Annealed Tungsten
Dependence of Material Properties on Processing History during Wire Drawing of Commercially Doped Tungsten Lamp Wire