Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

N. Kinjo; M. Ogata; K. Nishi; A. Kaneda

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Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

N. Kinjo , M. Ogata , K. Nishi and A. Kaneda

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This chapter is in the book Speciality Polymers / Polymer Physics

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APA
Harvard
Chicago
Vancouver

Kinjo, N., Ogata, M., Nishi, K. and Kaneda, A.. "Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices". Speciality Polymers / Polymer Physics, edited by , Berlin, Boston: De Gruyter, 1989, pp. 1-48. https://doi.org/10.1515/9783112484647-002

Kinjo, N., Ogata, M., Nishi, K. & Kaneda, A. (1989). Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices. In (Ed.), Speciality Polymers / Polymer Physics (pp. 1-48). Berlin, Boston: De Gruyter. https://doi.org/10.1515/9783112484647-002

Kinjo, N., Ogata, M., Nishi, K. and Kaneda, A. 1989. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices. In: . ed. Speciality Polymers / Polymer Physics. Berlin, Boston: De Gruyter, pp. 1-48. https://doi.org/10.1515/9783112484647-002

Kinjo, N., Ogata, M., Nishi, K. and Kaneda, A.. "Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices" In Speciality Polymers / Polymer Physics edited by , 1-48. Berlin, Boston: De Gruyter, 1989. https://doi.org/10.1515/9783112484647-002

Kinjo N, Ogata M, Nishi K, Kaneda A. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices. In: (ed.) Speciality Polymers / Polymer Physics. Berlin, Boston: De Gruyter; 1989. p.1-48. https://doi.org/10.1515/9783112484647-002

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Chapters in this book

Frontmatter I
Editors V
Table of Contents VII
Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices 1
Synthesis and Structure of Macromolecular Topological Compounds 49
Reactions and Photodynamics in Polymer Solids 77
Thermotropic Mesophases in Element-Organic Polymers 129
Author Index Volume 1-88 181
Subject Index 195

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https://doi.org/10.1515/9783112484647-002

Chapters in this book

Frontmatter I
Editors V
Table of Contents VII
Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices 1
Synthesis and Structure of Macromolecular Topological Compounds 49
Reactions and Photodynamics in Polymer Solids 77
Thermotropic Mesophases in Element-Organic Polymers 129
Author Index Volume 1-88 181
Subject Index 195

Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

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Chapters in this book

Chapters in this book