Article
Publicly Available
Plasma and gaseous etching of compounds of Groups III-V
-
D. E. Ibbotson
Published/Copyright:
January 1, 2009
Published Online: 2009-01-01
Published in Print: 1988-01-01
© 2013 Walter de Gruyter GmbH, Berlin/Boston
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- Inductively coupled plasmas in analytical atomic spectrometry: excitation mechanisms and analytical feasibilities
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- Plasma reactors for process metallurgy applications
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- Behaviour of NOx in air-fed ozonizers
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- Diagnostics and control of low pressure plasmas for the chemical vapor deposition (CVD) of amorphous semiconductor and insulator films
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- Arc discharge and electrode phenomena
- Effect of frequency from 'low frequency' to microwave on the plasma deposition of thin films
Articles in the same Issue
- Control and diagnostics of reactive plasma by photochemical and photoionization techniques
- Thermal plasma processing in the nineties
- Plasma deposition and properties of composite metal/polymer and metal/hard carbon films
- Industrial-worthy plasma torches: State-of-the-art
- Plasma deposition of amorphous silicon films: an overview on some open questions
- Mechanism of the ozone formations in a near liquid nitrogen temperature medium pressure glow discharge positive column
- Particle heating in a thermal plasma
- Impulse corona simulation for flue gas treatment
- Diagnostics of thermal plasma
- Inductively coupled plasmas in analytical atomic spectrometry: excitation mechanisms and analytical feasibilities
- Plasma polymerization of unsaturated alcohols for deposition of hydrophilic thin film
- Plasma and gaseous etching of compounds of Groups III-V
- Processing of a thermal plasma flow in a tube
- High Tc superconducting oxide films prepared by sputtering
- Plasma reactors for process metallurgy applications
- Pulse corona induced plasma chemical process: a horizon of new plasma chemical technologies
- Amorphous Si and Si-based alloys from glow-discharge plasma
- Behaviour of NOx in air-fed ozonizers
- Excited states of plasmas for steel surface nitriding and TiN deposition
- Mechanisms of decomposition of hydrocarbons in electrical discharges
- Diagnostics and control of low pressure plasmas for the chemical vapor deposition (CVD) of amorphous semiconductor and insulator films
- Ionized cluster beam (ICB) deposition and processes
- Expanding plasma used for plasma deposition
- Arc discharge and electrode phenomena
- Effect of frequency from 'low frequency' to microwave on the plasma deposition of thin films